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Backup Board Copper Clad Laminate
. Flexible Copper Clad Laminate
  <LPET Flexible Copper Clad Laminate
     LPI Flexible Copper Clad Laminate>
. Rigid Copper Clad Laminate
  <XPC Copper Clad Laminate
     FR1 Copper Clad Laminate
     FR2 Copper Clad Laminate
     FR4 Copper Clad Laminate
     CEM-1 Copper Clad Laminate
     CEM-3 Copper Clad Laminate>
LPET Flexible Copper Clad Laminate

LPET Flexible Copper Clad Laminate is polyester (PET) film based flexible copper clad laminate. There exist two types according to different adhesive types: flame retardant and non-flame retardant.

Application:
Widely used in the data communication, personal computer, and automotive fields.

Features:
. -High bond strength and good chemical resistance;
. Excellent dimensional stability;

Specifications:
. Thickness of PET film: 1mil(0.025mm),2mils(0.05mm),3mils(0.075mm),4mils(0.10mm) and 5mils(0.125mm). 
. Copper Types: 18µm, 35µm, 70µm;
. Width:24 inches or 500mm 
. Standard Roll: 50 square meters or 500 square feet per roll;
. Inner Core Diameter: 6 inches (152mm);
. Other size: As specified by customers. Single side and double side clad available.

Properties:
Item Unit Test method Standard value (Non-FR) Standard value (FR)
1 2 1 2
Peel Strength As received Method B 1b/in. width IPC-TM-650-2.4.8 6.0 7.0 6.0 7.0
After sold float Method D 6.0 7.0 N/A
After temperature cycling Method F 6.0 7.0 N/A
Tensile Strength 1b/in 2 IPC-TM-650-2.4.19 22,000 22,000
Elongation % IPC-TM-650-2.4.19 90 90
Initiation Teer Strength gms IPC-TM-650-2.4.16 800 800
Propagation Teer Strength gms IPC-TM-650-2.4.17.1 Varied 10
Flexual Endurance Cycles IPC-TM-650-2.4.3 1n 1200 In 400 In 1000 In 200
Out 800 Out 100 Out 700 Out 80
Dimensional Stability Method B % IPC-TM-650-2.2.4 ± 0.20 ± 0.20
Method C ± 0.40 ± 0.40
Flammability IPC-TM-650-2.3.8 N/A 94-V-0
Solder Float Q000085 5sec./400 0 F Pass 5sec./400 0 F Pass
Flatness mm Q000060H 30 25
Chemical Rsistance % IPC-TM-650-2.3.2 Method A 80 80
Dielectric Constant (at 1MHZ) IPC-TM-650-2.5.5.3 3.5 3.2
Dissipation Factor (at 1MHZ) IPC-TM-650-2.5.5.3 0.015 0.015
Volume Resistivity Megohms-cm IPC-TM-650-2.5.17 10 6 10 9
Surface Resistance megohms IPC-TM-650-2.5.17 10 4 10 5
Insulation Resistance megohms IPC-TM-650-2..6.3.2 At ambient 10 5 10 6
Moisture Insulation Resistance megohms IPC-TM-650-2.6.3.2 10 4 10 5
Dielectric Strength Volts/mil ASTM-D-149 3000 2500
Moisture Absorbtion % IPC-TM-650-2.6.2 1.0 1.0
Remarks:
1,The data is applied to 1 mil(0.025mm) PET film and 35µm EDHD copper structure;
2, The data is applied to 3 mil(0.075mm) PET film and 35µm EDHD copper structure;
3, N/A:Not applicable.
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