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| LPI Flexible Copper Clad Laminate |
LPI Flexible Copper Clad Laminate is polyimide (PI) film based flexible copper clad laminate. There exist two types according to different adhesive: flame retardant and non-flame retardant.
Application:
Widely used in the data communication, avionics, aerospace, defense, personal computer, and automotive fields.
Features:
. High bond strength and good chemical resistance;
. Excellent dimensional stability;
Specifications:
. Thickness of PI film: 1mil(0.025mm),2mils(0.05mm),3mils(0.075mm),4mils(0.10mm) and 5mils(0.125mm).
. Copper Types: 18µm, 35µm, 70µm;
. Width:24 inches or 500mm
. Standard Roll: 50 square meters or 500 square feet per roll;
. Inner Core Diameter: 6 inches (152mm);
. Other size: As specified by customers. Single side and double side clad available.
Properties: |
| Item |
Unit |
Test method |
Standard value
(Non-FR) |
Standard value
(FR) |
| Peel Strength |
As received
Method B |
1b/in.
width |
IPC-TM-650-2.4.9 |
9.0 |
9.0 |
| After sold float
Method D |
9.0 |
9.0 |
| Tensile Strength |
1b/in 2 |
IPC-TM-650-2.4.19 |
24,000 |
24,000 |
| Elongation |
% |
IPC-TM-650-2.4.19 |
40 |
40 |
| Initiation Teer Strength |
gms |
IPC-TM-650-2.4.16 |
500 |
500 |
| Propagation Teer Strength |
gms |
IPC-TM-650-2.4.17.1 |
10 |
10 |
| Flexual Endurance |
Cycles |
IPC-TM-650-2.4.3 |
In 2000 |
In 1800 |
| Out 1500 |
Out 1200 |
| Dimensional Stability |
Method B |
% |
IPC-TM-650-2.2.4 |
±0.20 |
±0.15 |
| Method C |
±0.20 |
±0.15 |
| Flammability |
|
IPC-TM-650-2.3.8 |
N/A |
94-V-0 |
| Solder Float |
|
IPC-TM-650-2.4.13 |
260 0 C Pass(EDHD) |
260 0 C Pass(EDHD) |
| 288 0 C Pass(RA) |
288 0 C Pass(RA) |
| Low Temperature Flexibility |
|
IPC-TM-650-2.6.18 |
Pass |
Pass |
| Chemical Rsistance |
% |
IPC-TM-650-2.3.2
Method A |
80 |
80 |
| Dielectric Constant
(at 1MHZ) |
|
IPC-TM-650-2.5.5.3 |
3.50 |
3.51 |
| Dissipation Factor
(at 1MHZ) |
|
IPC-TM-650-2.5.3.3 |
0.015 |
0.018 |
| Volume Resistivity |
Megohms-cm |
IPC-TM-650-2.5.17 |
10 7 |
10 9 |
| Surface Resistance |
megohms |
IPC-TM-650-2.5.17 |
10 5 |
10 5 |
| Insulation Resistance |
megohms |
IPC-TM-650-2..6.3.2
At ambient |
10 5 |
10 5 |
| Moisture Insulation Resistance |
megohms |
IPC-TM-650-2.6.3.2 |
10 4 |
10 5 |
| Dielectric Strength |
Volts/mil |
ASTM-D-149 |
3500 |
2500 |
| Moisture Absorbtion |
% |
IPC-TM-650-2.6.2 |
4.0 |
4.0 |
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Remarks:
1, The data is applied to 1 mil(0.025mm) PI film and 35µm EDHD copper structure;
2, N/A:Not applicable. |
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