| Test Item |
Unit |
Condition |
Testing Method |
Typical Value |
| Solder Resistance(260℃) |
Sec |
A |
JIS6481 |
25~40 |
| Heat Resistance |
___ |
150 ℃ 30Min |
JIS6481 |
No Change |
| Peel Strength(Copper Foil 35µm) |
Kgf/cm |
A
260 ℃ 10 Sec |
JIS6481 |
1.8~2.0 |
| Flexural Strength |
Lengthwise |
Kgf/
mm 2 |
A |
JIS6481 |
14~16 |
| Crosswise |
12~13 |
| Volume Resistivity |
Ω.cm |
C-96/20/65
C-96/20/65 +C-96/40/90 |
JIS6481 |
1 x 10 13 ~10
14
1 x 10 12 ~10 13 |
| Surface Resistivity |
Adhesive side |
Ω |
C-96/20/65
C-96/20/65 +C-96/40/90 |
JIS6481 |
1 x 10 12 ~10
13
1 x 10 11 ~10 12 |
| Laminate Side |
C-96/20/65
C-96/20/65 +C-96/40/90 |
1 x 10 11 ~10
12
1 x 10 10 ~10 11 |
| Insulation Resistance |
Ω |
C-96/20/65
C-96/20/65 +D-2/100 |
JIS6481 |
1 x 10 11 ~10
12
1 x 10 7 ~10 10 |
| Chemical resistance |
___ |
3%NaOH 40 ℃ 3Min |
JIS6481 |
No Change |
| Boiled in Trichloroethylene for 3 Min |
N Change |
| Water Absorption |
% |
E-24/50+D-24/23 |
JIS6481 |
0.6~0.8 |
| Flammability |
Sec |
A |
UL94 |
Avg.3.0
Max.8.0 |
| Dielectric Constant(1MHz) |
___ |
C-96/20/65
C-96/20/65 +D-48/50 |
JIS6481 |
4.0~5.0
4.5~5.5 |
| Dissipation Factor |
___ |
C-96/20/65
C-96/20/65 +D-48/50 |
JIS6481 |
0.025~0.035
0.035~0.045 |
| CTI Value |
V |
0.1%NH 4 CI |
UL746A |
600 |
| Punching Temperature |
℃ |
A |
GEC-QA-007 |
Ambient~70 |