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| FR4 Copper Clad Laminate |
FR4 Copper Clad Laminate is glass fabric based epoxy resin copper clad laminate,which could be processed into single/double sided printed circuit board or core for multilayer printed circuit board.
Features:
. Different CTI grade (125V/175V/400V/600V) available upon request;
. Excellent dimensional stability: Small dimension and thickness changes after heating could warrant precise
positioning of circuits and improve the reliability of PTH,and improving surface mounting precision which is
propitious especially to the thickness control in multilayer PCB;
. Excellent heat and moisture resistance: Ion-migration is effectively minimized in hot and humid environment
avoiding the occurrence of measling.
Specifications:
. Thickness: 0.1mm-3.2mm(IPC-4101 Class B);
. Copper Clading: 18µm, 35µm, 70µm;
. Regular Size: 1020mm x 1220mm;914mm x 1220mm;1041mm x 1245mm;
. UV block FR4 board available;
. Unclad FR4 available;
. Other size: As specified by customers. Single side and double side clad available.
Properties: |
| Test Item |
Unit |
Condition |
Testing Method
IPC-4101 |
Standard Value
IPC-4101 |
Typical Value |
| Flexible Strength |
Kgf/
m 2 |
Lengthwise
Crosswise |
2.4.4 |
> 4.23>10 7
> 3.52>10 7 |
> 5.71>10 7
> 4.48>10 7 |
| 125 0 C |
2.4.4.1 |
> 2.11>10 7 |
3.5>10 7 |
| Peel Strength (35µm) |
Kg/cm |
A |
2.4.8 |
> 1.43 |
1.70 |
| Glass Transition (Tg) |
℃ |
E2/105 DSC |
2.4.25 |
> 170 |
171 |
| Flammability |
Sec |
E24/23 |
2.3.10 |
Avg. 5
Max. 10 |
1
4 |
| Thermal Stress |
Sec |
Float 288 0 C |
2.4.13.1 |
> 20 |
130 |
| Surface Resistance |
MΩ |
C96/35/90 |
2.5.17.1 |
> 1.0>10 4 |
1.2>10 6 |
| Volume Resistance |
MΩ-cm |
C96/35/90 |
2.5.17.1 |
> 1.0>10 6 |
1.7>10 7 |
| Permittivity |
___ |
Etched@1MHz |
2.5.5.3 |
< 5.4 |
4.4 |
| Loss Tangent |
___ |
Etched@1MHz |
2.5.5.3 |
< 0.035 |
0.014 |
| Moisture Absorption |
% |
D24/23 |
2.6.2.1 |
< 0.5 |
0.13 |
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Remark:
1,Typical value for reference only.
2,Naked FR4 is available. |
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