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| CEM-1 Copper Clad Laminate |
CEM-1 Copper Clad Laminate is composite epoxy,glass/paper based copper clad laminate which has good punchability of paper base board and excellent mechanical/electrical performance of glass fabric based board. It is suitable for high frequency and punching-required printed cirduit board.
Features:
. Different CTI grade (125V/175V/400V/600V) available upon request;
. Excellent heat resistance: Reliable under 288℃ for 20 Sec;
. Excellent performance in punching;
. Excellent heat and moisture resistance,CTI value and resistance of ion-migration.
Specifications:
. Thickness: 0.8mm-1.6mm(IPC-4101 Class B);
. Copper Clading: 18µm, 35µm, 70µm;
. Regular Size: 1020mm x 1020mm;1020mm x 1220mm;1067mm x 1220mm
. Other size: As specified by customers.
Properties: |
| Test Item |
Unit |
Condition |
Testing Method
IPC-4101 |
Standard
Value
IPC-4101 |
Typical Value |
| Flexible Strength |
Kgf/m 2 |
Lengthwise
Crosswise |
2.4.4 |
> 2.11>10 7
> 1.76>10 7 |
> 3.12>10 7
> 2.84>10 7 |
| Peel Strength (35µm) |
Kg/cm |
A |
2.4.8 |
> 1.43 |
2.0 |
| Flammability |
Sec |
E24/23 |
2.3.10 |
Avg. 5
Max. 10 |
1.9
7.0 |
| Thermal Stress |
Sec |
Float 288 0 C |
2.4.13.1 |
> 20 |
32 |
| Surface Resistance |
MΩ |
C96/35/90 |
2.5.17.1 |
> 1.0>10 4 |
1.0>10 6 |
| Volume Resistance |
MΩ-cm |
C96/35/90 |
2.5.17.1 |
> 1.0>10 6 |
1.0>10 8 |
| Permittivity |
___ |
Etched@1MHz |
2.5.5.3 |
< 5.4 |
4.4 |
| Loss Tangent |
___ |
Etched@1MHz |
2.5.5.3 |
< o.o35 |
0.024 |
| Moisture Absorption |
% |
D24/23 |
2.6.2.1 |
< 0.5 |
0.2 |
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| Remark: Typical value for reference only. |
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